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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Octal 3-State Non-Inverting Transparent Latch
High-Performance Silicon-Gate CMOS
The MC54/74HC373A is identical in pinout to the LS373. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. These latches appear transparent to data (i.e., the outputs change asynchronously) when Latch Enable is high. When Latch Enable goes low, data meeting the setup and hold time becomes latched. The Output Enable input does not affect the state of the latches, but when Output Enable is high, all device outputs are forced to the high-impedance state. Thus, data may be latched even when the outputs are not enabled. The HC373A is identical in function to the HC573A which has the data inputs on the opposite side of the package from the outputs to facilitate PC board layout. The HC373A is the non-inverting version of the HC533A. * * * * * * Output Drive Capability: 15 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 186 FETs or 46.5 Equivalent Gates LOGIC DIAGRAM
D0 D1 D2 DATA INPUTS D3 D4 D5 D6 D7 3 4 7 8 13 14 17 18 2 5 6 9 12 15 16 19 Q0 Q1 Q2
MC54/74HC373A
J SUFFIX CERAMIC PACKAGE CASE 732-03
1
20
20 1 20 1
N SUFFIX PLASTIC PACKAGE CASE 738-03 DW SUFFIX SOIC PACKAGE CASE 751D-04 SD SUFFIX SSOP PACKAGE CASE 940C-03 DT SUFFIX TSSOP PACKAGE CASE 948E-02
20 1 20 1
ORDERING INFORMATION MC54HCXXXAJ Ceramic MC74HCXXXAN Plastic MC74HCXXXADW SOIC MC74HCXXXASD SSOP MC74HCXXXADT TSSOP
PIN ASSIGNMENT
OUTPUT ENABLE Q0 D0 D1 Q3 Q4 Q5 Q6 Q7 PIN 20 = VCC PIN 10 = GND NONINVERTING OUTPUTS Q1 Q2 D2 D3 Q3 GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC Q7 D7 D6 Q6 Q5 D5 D4 Q4 LATCH ENABLE
OUTPUT ENABLE
10/95
(c) Motorola, Inc. 1995
IIIIIIIIIIIIIII II III I I IIIIIIIIIIIIIII II IIIIIIIIIIIIIII I III I II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII IIIIIIIIIIIII I IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II IIIIIIIIIIIIIII IIIIIIIIIIIII I IIIIIIIIIIIIIII II IIIIIIIIIIIIIII II
LATCH ENABLE 1 Design Criteria Value 46.5 1.5 5.0 Units ea ns Internal Gate Count* Internal Gate Propagation Delay Internal Gate Power Dissipation Speed Power Product W pJ 0.0075 * Equivalent to a two-input NAND gate. 1
11
FUNCTION TABLE
Inputs Output Enable L L L H Latch Enable H H L X D H L X X Output Q H L No Change Z
X = Don't Care Z = High Impedance
REV 6
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* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C Ceramic DIP: - 10 mW/_C from 100_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C SSOP or TSSOP Package: - 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I IIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII III IIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS*
MOTOROLA
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
RECOMMENDED OPERATING CONDITIONS
MC54/74HC373A
Symbol
Vin, Vout
Symbol
Symbol
VCC
Vout
Tstg
ICC
Iout
VCC
Vin
PD
TL
VOH
tr, tf
Iin
TA
VIH
VIL
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC, SSOP or TSSOP Package) (Ceramic DIP)
Storage Temperature
Power Dissipation in Still Air, Plastic or Ceramic DIP SOIC Package SSOP or TSSOP Package
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
DC Input Current, per Pin
DC Output Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Input Rise and Fall Time (Figure 1)
Operating Temperature, All Package Types
DC Input Voltage, Output Voltage (Referenced to GND)
DC Supply Voltage (Referenced to GND)
Minimum High-Level Output Voltage
Maximum Low-Level Input Voltage
Minimum High-Level Input Voltage
Parameter
Parameter
Parameter
Vin = VIH or VIL |Iout| 6.0 mA |Iout| 7.8 mA
Vin = VIH or VIL |Iout| 20 A
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v v
v
v
v
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
Test Conditions
- 0.5 to VCC + 0.5
- 1.5 to VCC + 1.5
- 65 to + 150
- 0.5 to + 7.0
2 - 55 Min 2.0 Value 0 0 0 0 75 35 20 260 300 750 500 450 + 125 1000 500 400 VCC Max 6.0 VCC V 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 Unit Unit mW mA mA mA
_C
_C
_C
ns
V
V
V
V
V
- 55 to 25_C
0.5 1.35 1.8
1.5 3.15 4.2
3.98 5.48
1.9 4.4 5.9
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Guaranteed Limit
v 85_C v 125_C
High-Speed CMOS Logic Data DL129 -- Rev 6 0.5 1.35 1.8 1.5 3.15 4.2 3.84 5.34 1.9 4.4 5.9
v
0.5 1.35 1.8
1.5 3.15 4.2
3.7 5.2 1.9 4.4 5.9
v
Unit
V V V
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NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High- Speed CMOS Data Book (DL129/D). NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
High-Speed CMOS Logic Data DL129 -- Rev 6 Symbol Symbol VOL tPZL tPZH tPLZ tPHZ tPLH tPHL tPLH tPHL tTLH tTHL CPD Cout ICC IOZ Cin Iin Maximum Quiescent Supply Current (per Package) Maximum Three-State Leakage Current Maximum Input Leakage Current Maximum Low-Level Output Voltage Power Dissipation Capacitance (Per Enabled Output)* Maximum Three-State Output Capacitance (Output in High-Impedance State) Maximum Input Capacitance Maximum Output Transition Time, Any Output (Figures 1 and 5) Maximum Propagation Delay, Output Enable to Q (Figures 3 and 6) Maximum Propagation Delay, Output Enable to Q (Figures 3 and 6) Maximum Propagation Delay, Latch Enable to Q (Figures 2 and 5) Maximum Propagation Delay, Input D to Q (Figures 1 and 5) Parameter Parameter Vin = VIH or VIL |Iout| 6.0 mA |Iout| 7.8 mA Vin = VCC or GND |Iout| = 0 A Vin = VCC or GND
* Used to determine the no-load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Output in High-Impedance State Vin = VIL or VIH Vout = VCC or GND
Vout = 0.1 V or VCC - 0.1 V |Iout| 20 A
v v
v
Test Conditions
3 VCC V VCC V 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 6.0 6.0 6.0 4.5 6.0 2.0 4.5 6.0 - 55 to 25_C - 55 to 25_C Typical @ 25C, VCC = 5.0 V 0.5 0.1 0.26 0.26 150 30 26 150 30 26 140 28 24 125 25 21 4.0 0.1 0.1 0.1 15 10 60 12 10 Guaranteed Limit Guaranteed Limit 5.0 1.0 0.33 0.33 190 38 33 190 38 33 175 35 30 155 31 26 0.1 0.1 0.1 15 10 75 15 13 40 36 1.0 10 225 45 38 225 45 38 210 42 36 190 38 32 160 0.4 0.4 0.1 0.1 0.1 15 10 90 18 15
v 85_C v 125_C
v 85_C v 125_C
MC54/74HC373A
MOTOROLA Unit Unit A A A pF pF pF ns ns ns ns ns V
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TIMING REQUIREMENTS (CL = 50 pF, Input tr = tf = 6.0 ns)
MOTOROLA
MC54/74HC373A
Symbol
OUTPUT ENABLE
INPUT D
tr, tf
tsu
tw
th
Q
Q
Q
tPLH
Maximum Input Rise and Fall Times
Minimum Pulse Width, Latch Enable
Minimum Hold Time, Latch Enable to Input D
Minimum Setup Time, Input D to Latch Enable
tr
50%
tTLH
50%
1.3 V
90% 50% 10%
90% 50% 10%
Figure 3.
Figure 1.
tPZL
tPZH
tPHZ
tPLZ
Parameter
tf
10%
90%
tPHL
tTHL
SWITCHING WAVEFORMS
HIGH IMPEDANCE
VOH
VOL
HIGH IMPEDANCE
GND
VCC
GND
VCC
Fig.
4 1 2 4 4 LATCH ENABLE LATCH ENABLE VCC Volts 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 INPUT D Q - 55 to 25_C Min 5.0 5.0 5.0 25 5.0 5.0 60 12 10 50% 1000 500 400 Max 50% tw tPLH 50% Min 5.0 50 5.0 30 6.0 6.0 75 15 13 tsu
Guaranteed Limit
Figure 4.
Figure 2.
v 85_C
VALID
tPHL
1000 500 400
High-Speed CMOS Logic Data DL129 -- Rev 6 Max 50% th Min 5.0 5.0 5.0 40 8.0 7.0 90 18 15
v 125_C
1000 500 400
Max
GND
VCC
GND VCC VCC Unit ns ns ns ns GND
MC54/74HC373A
TEST CIRCUITS
TEST POINT OUTPUT DEVICE UNDER TEST DEVICE UNDER TEST TEST POINT OUTPUT CL* 1 k CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH.
CL*
* Includes all probe and jig capacitance
* Includes all probe and jig capacitance
Figure 5.
Figure 6.
EXPANDED LOGIC DIAGRAM
D0 3 D Q D1 4 D Q D2 7 D Q D3 8 D Q D4 13 D Q D5 14 D Q D6 17 D Q D7 18 D Q
LE 11
LE
LE
LE
LE
LE
LE
LE
1 2 Q0 5 Q1 6 Q2 9 Q3 12 Q4 15 Q5 16 Q6 19 Q7
High-Speed CMOS Logic Data DL129 -- Rev 6
5
MOTOROLA
MC54/74HC373A
OUTLINE DIMENSIONS
J SUFFIX CERAMIC PACKAGE CASE 732-03 ISSUE E
B A F C L
DIM A B C D F G H J K L M N NOTES: 1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE POSITION AT SEATING PLANE, AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONS A AND B INCLUDE MENISCUS. MILLIMETERS MIN MAX 23.88 25.15 6.60 7.49 3.81 5.08 0.38 0.56 1.40 1.65 2.54 BSC 0.51 1.27 0.20 0.30 3.18 4.06 7.62 BSC 0_ 15 _ 0.25 1.02 INCHES MIN MAX 0.940 0.990 0.260 0.295 0.150 0.200 0.015 0.022 0.055 0.065 0.100 BSC 0.020 0.050 0.008 0.012 0.125 0.160 0.300 BSC 0_ 15_ 0.010 0.040
20 1
11 10
N H D
SEATING PLANE
G
K
J M
-A-
20 11
N SUFFIX PLASTIC PACKAGE CASE 738-03 ISSUE E
B
1
10
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01
-T-
SEATING PLANE
K M E G F D
20 PL
N J 0.25 (0.010)
M 20 PL
0.25 (0.010) TA
M
M
TB
M
DIM A B C D E F G J K L M N
-A-
20 11
DW SUFFIX PLASTIC SOIC PACKAGE CASE 751D-04 ISSUE E
10X
-B-
1 10
P 0.010 (0.25)
M
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029
20X
D
M
0.010 (0.25)
TA
S
B
J
S
F R X 45 _ C -T-
18X SEATING PLANE
G
K
M
MOTOROLA
6
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HC373A
OUTLINE DIMENSIONS
SD SUFFIX PLASTIC SSOP PACKAGE CASE 940C-03 ISSUE B
20X
K REF 0.12 (0.005)
M
TU
S
V
0.25 (0.010)
S
N M N
L/2 L
PIN 1 IDENT
20
11
B
1 10
F DETAIL E
K
A -V- 0.20 (0.008)
M
-U- J
S
J1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF K DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION K BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 7.07 7.33 5.20 5.38 1.73 1.99 0.05 0.21 0.63 0.95 0.65 BSC 0.59 0.75 0.09 0.20 0.09 0.16 0.25 0.38 0.25 0.33 7.65 7.90 0_ 8_ INCHES MIN MAX 0.278 0.288 0.205 0.212 0.068 0.078 0.002 0.008 0.024 0.037 0.026 BSC 0.023 0.030 0.003 0.008 0.003 0.006 0.010 0.015 0.010 0.013 0.301 0.311 0_ 8_
TU
SECTION N-N -W-
0.076 (0.003) -T-
SEATING PLANE
C D G H
DETAIL E
20X
K REF
DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948E-02 ISSUE A
M
2X
L/2
20
11
L
PIN 1 IDENT 1 10
B -U-
J J1
N 0.15 (0.006) T U
S
A -V- N F
C D 0.100 (0.004) -T- SEATING
PLANE
G
H
DETAIL E
High-Speed CMOS Logic Data DL129 -- Rev 6
7
IIII IIII IIII IIII
0.15 (0.006) T U
S
0.10 (0.004)
TU
S
V
S
EEE CCC EEE CCC EEE CCC EEE CCC
K1 K K1 DETAIL E
SECTION N-N
0.25 (0.010)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
M
DIM A B C D F G H J J1 K K1 L M
-W-
MOTOROLA
MC54/74HC373A
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
How to reach us: USA/EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 MFAX: RMFAX0@email.sps.mot.com -TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA
CODELINE
8
*MC54/74HC373A/D*
MC54/74HC373A/D High-Speed CMOS Logic Data DL129 -- Rev 6

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